COM*RoHS
FREELEAD
Features
nCompactdesigntosaveboardspace0805footprint
nSmallsizeresultsinveryfasttimetoreacttofaultevents
nSymmetricaldesign
nLowprofile
npliant*andhalogenfree**
nAgencyrecognition:
Applications
nUSBportprotection-USB2.0,3.0&OTGnHDMI1.4SourceprotectionnPCmotherboards-PlugandPlay
protectionnMobilephones-BatteryandportprotectionnPDAs/digitalcamerasnGameconsoleportprotection
MF-PSMFSeries-PTCResettableFuses
ElectricalCharacteristics
Model
Vmax.Volts
MF-PSMF010X
15
MF-PSMF010/24X***24
MF-PSMF020X
9 MF-PSMF035X
6 MF-PSMF050X
6 MF-PSMF075X
6 MF-PSMF110X
6 ***TÜVapprovalpending. DFRESEARILhEIAoNTl*dImaxL.EARSIONOMP Itrip AmpsVEHSC Amperes Ro at23°
C Hold Trip 40 0.10 0.30 80 0.10 0.30 40 0.20 0.50 40 0.35 0.75 40 0.50 1.00 40 0.75 1.50 40 1.10 2.20 Resistance Ohms at
23
C Secondsat23°
C 0.5 1.5 0.5 1.5 8.00 0.02 8.00 0.10 8.00 0.10 8.00 0.20 8.00 0.30 Tripped
PowerDissipationWattsat23°
C Typ.0.50.50.50.50.50.60.6 EnvironmentalCharacteristicsOperatingTemperature..........................................-40°Cto+85°CPassiveAging........................................................+85°C,1000hours................................................±5%typicalresistancechangeHumidityAging......................................................+85°C,85%
R.H.1000hours..............................±5%typicalresistancechangeThermalShock......................................................+85°Cto-40°C,20times.....................................±10%typicalresistancechangeSolventResistance................................................MIL-STD-202,Method215....................................NochangeVibration................................................................MIL-STD-883C,Method2007.1,............................Nochange ConditionA TestProceduresAndRequirementsForModelMF-PSMFSeries Test TestConditions ept/RejectCriteria Visual/Mech...........................................................Verifydimensionsandmaterials............................PerMFphysicaldescription Resistance.............................................................Instillair@23°C..................................................Rmin≤R≤R1max TimetoTrip............................................................Atspecifiedcurrent,Vmax,23°C..........................T≤max.timetotrip(seconds) HoldCurrent..........................................................30min.atIhold......................................................Notrip TripCycleLife........................................................Vmax,Imax,100cycles.........................................Noarcingorburning TripEndurance......................................................Vmax,48hours......................................................Noarcingorburning Solderability...........................................................ANSI/J-STD-002....................................................95%min.coverage ULFileNumber.....................................................E174545/FollowlinktoCertifications,thenULFileNo.,enterE174545 TÜVCertificateNumber........................................R50171531/Followlinkto“othercertificates”,enterFileNo.50171531 ThermalDeratingChart-Ihold(Amps) Model MF-PSMF010XMF-PSMF010/24XMF-PSMF020XMF-PSMF035XMF-PSMF050XMF-PSMF075XMF-PSMF110X -40°C0.150.150.280.470.681.001.45 -20°C0.130.130.250.440.620.901.35 AmbientOperatingTemperature 0°
C 23°
C 40°
C 50°
C 60°
C 0.12 0.10 0.09 0.08 0.07 0.12 0.10 0.09 0.08 0.07 0.23 0.20 0.17 0.14 0.12 0.39 0.35 0.30 0.27 0.24 0.55 0.50 0.40 0.37 0.33 0.79 0.75 0.63 0.57 0.53 1.20 1.10 0.92 0.84 0.75 70
°C0.060.060.100.200.290.420.65 85°C0.050.050.070.140.230.350.52 *RoHSDirective2002/95/ECJan.27,2003includingannexandRoHSRecast2011/65/EUJune8,2011.**Bournsconsidersaproducttobe“halogenfree”if(a)theBromine(Br)contentis900ppmorless;(b)theChlorine(Cl)contentis900ppmorless;and(c)thetotalBromine(Br) andChlorine(Cl)contentis1500ppmorless.Specificationsaresubjecttochangewithoutnotice.Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.Usersshouldverifyactualdeviceperformanceintheirspecificapplications. AdditionalApplications nAutomotiveelectroniccontrolmodules MF-PSMFSeries-PTCResettableFuses ProductDimensions ModelMF-PSMF010XMF-PSMF010/24XMF-PSMF020XMF-PSMF035XMF-PSMF050XMF-PSMF075XMF-PSMF110X Min.2.00(0.079)2.00(0.079)2.00(0.079)2.00(0.079)2.00(0.079)2.00(0.079)2.00(0.079) Packaging:3000pcs.perreel. TopView BottomView
A AMax.2.30(0.091)2.30(0.091)2.30(0.091)2.30(0.091)2.30(0.091)2.30(0.091)2.30(0.091) SideView
C 4
B D TypicalTimetoTripat23˚
C 1.00±0.05(.039±.002) TheTimetoTripcurvesrepresenttypicalperformanceofadeviceinasimulatedapplicationenvironment.Actualperformanceinspecificcustomerapplicationsmaydifferfromthesevaluesduetotheinfluenceofothervariables.
B Min. Max. 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) mendedPadLayout 1.50±0.10(.059±.004) 1.20±0.10(.047±.004)
C Min. Max. 0.48(0.019) 0.85(0.033) 0.48(0.019) 0.85(0.033) 0.48(0.019) 0.85(0.033) 0.48(0.019) 0.85(0.033) 0.48(0.019) 0.85(0.033) 0.75(0.030) 1.25(0.049) 0.75(0.030) 1.25(0.049) DMin.0.20(0.008)0.20(0.008)0.20(0.008)0.20(0.008)0.20(0.008)0.20(0.008)0.20(0.008) DIMENSIONS:MM(INCHES) Terminalmaterial:Nickel/goldplated. Terminationpadsolderability:StandardAufinish:MeetsANSI/J-STD-002Category2. mendedStorage:40°Cmax./70%RHmax. 10 MF-PSMF020X
1 MF-PSMF035XMF-PSMF050XMF-PSMF075X MF-PSMF110X MF-PSMF010X0.1 TimetoTrip(Seconds) MF-PSMF010/24X0.01 Specificationsaresubjecttochangewithoutnotice.Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.Usersshouldverifyactualdeviceperformanceintheirspecificapplications. 0.001 0.00010.1
1 10 100 Current(Amps) MF-PSMFSeries-PTCResettableFuses Temperature SolderReflowmendations TPTLTSMAX. RAMP-UP TSMIN.25 tsPREHEAT t25*CTOPEAK Time tptL CRITICALZONETLTOTP RAMP-DOWN 8MINS. Notes:•MF-FSMLmodelscannotbewavesolderedorhandsoldered.Please contactBournsforsolderingmendations.•Alltemperaturesrefersideofthepackage,measuredonthe packagebodysurface.•Ifreflowtemperaturesexceedthemendedprofile,devicesmay notmeetthepublishedspecifications.•CompatiblewithPbandPb-freesolderreflowprofiles.•Excesssoldermaycauseashortcircuit,especiallyduringhand soldering.PleaserefertotheMultifuse®PolymerPTCSolderingmendationguidelines.•Designedforsinglesolderreflowoperations. ProfileFeature Pb-FreeAssembly AverageRamp-UpRate(TSmaxtoTp) 3°C/secondmax. PREHEAT: TemperatureMin.(TSmin)TemperatureMax.(TSmax)TimDePesrc(otrcsiepmstisoinntotsmax) Materials Temperature
1.TApIMplyEsoMldAerINpaTstAeItNoEDAB•OSVnE96:.5/Ag3.0/Cu0.5Roomtemperature testTbeoamrdp(e8r-a1t0urmeil(tThiIc)k) Alloywatersolubleornocleansolderpaste Time(tL) (seenote1) Peak/ClassificationTe•ms(Gpin1eg0lre)a(stUiudLreedapepp(rTooxvPye)dg)lass Timewithin5°CofActu•aPlCPbeoaarkdaTpepmroxp.e4rxa4xtu.0r6ein.(tp)
2.Placetestunitsontoboard6units/board
3.RRaammppu-pDownRateConvectionoven (seenote2) TimeInterval 2.5°C±0.5°/sec. 150°C200°CIancscpeepctatbsloeld(ie.er.joe6ixnh0tib~toi1tsd8ew0teertsmtieningceooifnfjsodoisnldt’esrsjouirnfatcise). Usethefollowingcriteria(ref.eptabilityofprintedboardassemblies,IPC-A-610): A)eptable(seeFig2ur1e71)°C
(1)Thesolde6r0c~on1n5ec0tiosnewcoetntindgsangle(soldertocdoomespnoontenextcaenedd2s96o0l0d°e.°rCtoPCBtermination)
(2)Solderbal2ls0t~ha4t0dosneoctovinoldatseminimum electricalclearancesandareattached (soldere6d)°tCoa/mseetcalosnudrfamcea.x.
4.TPrimeheeatw(TitSh)in25°CtoPeakTemperature
5.Timeaboveliquidus(TL)
6.Peaktemperature(TP) HowtoOrder
7.RampdownMF-PSMF010/24X-
2 Multifuse®Product D8.eCsleiganniantgorwatercleanprofileHighpressuredeionized Series water65PSImax. PSMF=0805SurfaceMount Component HToelmd01pC0eu-rr1ar1et0nutr(,e0I.ho1o0fldL-e1a.1d0/PAamdpsJ)unction (HDeigrihveedruVsoinltgag6e-zoOnpetCioonnvectionOven)Blank=StandardVoltage/24=24V Multifuse®freeXpansion™Design PackagingPackagedperEIA481-1-2=TapeandReel 150°Cto190°C90±30sec. B)eptable8(smeeiFniguutrees2)max. 220°
C 60-90sec. 250°C+0°/-5°TypicalPartM10a-2r0ksinecg.within 5°Cofpeak
(1)Solderconnectionwettingangleexceeding90°. (2)pletereflowofsolderpaste.
(3)Dewetting. RRooemptreemspeenrattsurteota3l°cCo±n0te.5n°tC./sLeacy.vepatrayb.le,determinecauseandcorrectpriorto (seenote2) PARTIDEnNeTxIFtIrCuAnT.ION: 72°Fto160°F(22°Cto71°C) Asrequired
4 BIWEEKLYDATECODE MF-PSMFN01O0TXE=S1: MF-PSMF010/24X=MF-PSMF10.20XW=at2er 1soluble solder pAassteiaon-lPyaabcovifei1c0:0K. MF-PSMF035X=32.Refer to ref. temperatuTreepl:ro+fi8le8.T6e-m2pe2ra5tu6r2e-a4t117 MF-PSMF050X=4MF-PSMF075Xle=ad5/pad junction with E“Km”taypile: uosup@leb. WILLAPPEARONTHEPACKAGINGLABEL:WEEK1AND2=AWEEK51AND52=
Z MF-PSMF31.10XUn=i6tsthatareboardmEouuntreodpfoer:environmental testingmustseeazone,asspecified. pTehaisTkeitselmt:o+pee3nrsa6utur8ree8thina5tth2ael0lrtee3fslot9w0 unitswillsee“worstcaEsemcaonild:iteiounsro”.cus@
4.RampdownratetobeTmheaesuAremdferormic2a45s:°Cto 150°
C. Tel:+1-951781-5500 5.fPrraomceestsrimDemscerrisp.tion8Edomesaniol:taapmplyetroicoupesn@ MF-PSMFSERIES,REV.O05/17 “freeXpansionDesign”isatrademarkofBourns,Inc.Specificationsaresubjecttochangewithoutnotice.Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.Usersshouldverifyactualdeviceperformanceintheirspecificapplications. MF-PSMFSeriesTapeandReelSpecifications TapeDimensions WP0P1P2A0B0B1max.D0FE1E2min.Tmax.T1max.K0Leadermin.Trailermin.ReelDimensionsAmax.Nmin.W1W2max.
T D0 COVERTAPE B1 P0P2 MF-PSMF010X,MF-PSMF010/24X,MF-PSMF020X,MF-PSMF035X& MF-PSMF050XperEIA481-1 8.0±0.30(0.315±0.012) 4.0±0.10(0.157±0.004) 4.0±0.10(0.157±0.004) 2.0±0.05(0.079±0.002) 1.65±0.10(0.065±0.004) 2.4±0.10(0.094±0.004) 4.35(0.171)1.50+0.10/-0.0(0.059+0.004/-0)3.5±0.05(0.138±0.002)1.75±0.10(0.069±0.004) 6.25(0.246) 0.6(0.024) 0.10(0.004)0.95±0.10(0.037±0.004) 390(15.35) 160(6.30) 185(7.28) 50(1.97)8.4+1.5/-0.0(0.331+0.059/-0)14.4(0.567) UNIT=MM(INCHES) E1 FA E2W MF-PSMF075X&MF-PSMF110XperEIA481-1 8.0±0.30(0.315±0.012) 4.0±0.10(0.157±0.004) 4.0±0.10(0.157±0.004) 2.0±0.05(0.079±0.002) 1.65±0.10(0.065±0.004) 2.4±0.10(0.094±0.004) 4.35(0.171)1.50+0.10/-0.0(0.059+0.004/-0)3.5±0.05(0.138±0.002)1.75±0.10(0.069±0.004) 6.25(0.246) 0.6(0.024) 0.10(0.004)1.25±0.10(0.049±0.004) 390(15.35) 160(6.30) 185(7.28) 50(1.97)8.4+1.5/-0.0(0.331+0.059/-0)14.4(0.567) W2(MEASUREDATHUB) N(HUBDIA.) B0 K0 P1 T1 A0 Specificationsaresubjecttochangewithoutnotice.Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.Usersshouldverifyactualdeviceperformanceintheirspecificapplications. W1(MEASUREDATHUB) MouserElectronics AuthorizedDistributor ClicktoViewPricing,Inventory,Delivery&LifecycleInformation: Bourns: MF-PSMF050X-2MF-PSMF075X-2MF-PSMF110X-2MF-PSMF020X-2MF-PSMF035X-2MF-PSMF010X-
2
9 MF-PSMF035X
6 MF-PSMF050X
6 MF-PSMF075X
6 MF-PSMF110X
6 ***TÜVapprovalpending. DFRESEARILhEIAoNTl*dImaxL.EARSIONOMP Itrip AmpsVEHSC Amperes Ro at23°
C Hold Trip 40 0.10 0.30 80 0.10 0.30 40 0.20 0.50 40 0.35 0.75 40 0.50 1.00 40 0.75 1.50 40 1.10 2.20 Resistance Ohms at
23
°
C
RMin.
R1Max.
1.0
7.5
1.0
7.5
0.65
3.5
0.250
1.200
0.150
0.900
0.090
0.350
0.060
0.210
Max.
C Secondsat23°
C 0.5 1.5 0.5 1.5 8.00 0.02 8.00 0.10 8.00 0.10 8.00 0.20 8.00 0.30 Tripped
PowerDissipationWattsat23°
C Typ.0.50.50.50.50.50.60.6 EnvironmentalCharacteristicsOperatingTemperature..........................................-40°Cto+85°CPassiveAging........................................................+85°C,1000hours................................................±5%typicalresistancechangeHumidityAging......................................................+85°C,85%
R.H.1000hours..............................±5%typicalresistancechangeThermalShock......................................................+85°Cto-40°C,20times.....................................±10%typicalresistancechangeSolventResistance................................................MIL-STD-202,Method215....................................NochangeVibration................................................................MIL-STD-883C,Method2007.1,............................Nochange ConditionA TestProceduresAndRequirementsForModelMF-PSMFSeries Test TestConditions ept/RejectCriteria Visual/Mech...........................................................Verifydimensionsandmaterials............................PerMFphysicaldescription Resistance.............................................................Instillair@23°C..................................................Rmin≤R≤R1max TimetoTrip............................................................Atspecifiedcurrent,Vmax,23°C..........................T≤max.timetotrip(seconds) HoldCurrent..........................................................30min.atIhold......................................................Notrip TripCycleLife........................................................Vmax,Imax,100cycles.........................................Noarcingorburning TripEndurance......................................................Vmax,48hours......................................................Noarcingorburning Solderability...........................................................ANSI/J-STD-002....................................................95%min.coverage ULFileNumber.....................................................E174545/FollowlinktoCertifications,thenULFileNo.,enterE174545 TÜVCertificateNumber........................................R50171531/Followlinkto“othercertificates”,enterFileNo.50171531 ThermalDeratingChart-Ihold(Amps) Model MF-PSMF010XMF-PSMF010/24XMF-PSMF020XMF-PSMF035XMF-PSMF050XMF-PSMF075XMF-PSMF110X -40°C0.150.150.280.470.681.001.45 -20°C0.130.130.250.440.620.901.35 AmbientOperatingTemperature 0°
C 23°
C 40°
C 50°
C 60°
C 0.12 0.10 0.09 0.08 0.07 0.12 0.10 0.09 0.08 0.07 0.23 0.20 0.17 0.14 0.12 0.39 0.35 0.30 0.27 0.24 0.55 0.50 0.40 0.37 0.33 0.79 0.75 0.63 0.57 0.53 1.20 1.10 0.92 0.84 0.75 70
°C0.060.060.100.200.290.420.65 85°C0.050.050.070.140.230.350.52 *RoHSDirective2002/95/ECJan.27,2003includingannexandRoHSRecast2011/65/EUJune8,2011.**Bournsconsidersaproducttobe“halogenfree”if(a)theBromine(Br)contentis900ppmorless;(b)theChlorine(Cl)contentis900ppmorless;and(c)thetotalBromine(Br) andChlorine(Cl)contentis1500ppmorless.Specificationsaresubjecttochangewithoutnotice.Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.Usersshouldverifyactualdeviceperformanceintheirspecificapplications. AdditionalApplications nAutomotiveelectroniccontrolmodules MF-PSMFSeries-PTCResettableFuses ProductDimensions ModelMF-PSMF010XMF-PSMF010/24XMF-PSMF020XMF-PSMF035XMF-PSMF050XMF-PSMF075XMF-PSMF110X Min.2.00(0.079)2.00(0.079)2.00(0.079)2.00(0.079)2.00(0.079)2.00(0.079)2.00(0.079) Packaging:3000pcs.perreel. TopView BottomView
A AMax.2.30(0.091)2.30(0.091)2.30(0.091)2.30(0.091)2.30(0.091)2.30(0.091)2.30(0.091) SideView
C 4
B D TypicalTimetoTripat23˚
C 1.00±0.05(.039±.002) TheTimetoTripcurvesrepresenttypicalperformanceofadeviceinasimulatedapplicationenvironment.Actualperformanceinspecificcustomerapplicationsmaydifferfromthesevaluesduetotheinfluenceofothervariables.
B Min. Max. 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) 1.20(0.047) 1.50(0.059) mendedPadLayout 1.50±0.10(.059±.004) 1.20±0.10(.047±.004)
C Min. Max. 0.48(0.019) 0.85(0.033) 0.48(0.019) 0.85(0.033) 0.48(0.019) 0.85(0.033) 0.48(0.019) 0.85(0.033) 0.48(0.019) 0.85(0.033) 0.75(0.030) 1.25(0.049) 0.75(0.030) 1.25(0.049) DMin.0.20(0.008)0.20(0.008)0.20(0.008)0.20(0.008)0.20(0.008)0.20(0.008)0.20(0.008) DIMENSIONS:MM(INCHES) Terminalmaterial:Nickel/goldplated. Terminationpadsolderability:StandardAufinish:MeetsANSI/J-STD-002Category2. mendedStorage:40°Cmax./70%RHmax. 10 MF-PSMF020X
1 MF-PSMF035XMF-PSMF050XMF-PSMF075X MF-PSMF110X MF-PSMF010X0.1 TimetoTrip(Seconds) MF-PSMF010/24X0.01 Specificationsaresubjecttochangewithoutnotice.Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.Usersshouldverifyactualdeviceperformanceintheirspecificapplications. 0.001 0.00010.1
1 10 100 Current(Amps) MF-PSMFSeries-PTCResettableFuses Temperature SolderReflowmendations TPTLTSMAX. RAMP-UP TSMIN.25 tsPREHEAT t25*CTOPEAK Time tptL CRITICALZONETLTOTP RAMP-DOWN 8MINS. Notes:•MF-FSMLmodelscannotbewavesolderedorhandsoldered.Please contactBournsforsolderingmendations.•Alltemperaturesrefersideofthepackage,measuredonthe packagebodysurface.•Ifreflowtemperaturesexceedthemendedprofile,devicesmay notmeetthepublishedspecifications.•CompatiblewithPbandPb-freesolderreflowprofiles.•Excesssoldermaycauseashortcircuit,especiallyduringhand soldering.PleaserefertotheMultifuse®PolymerPTCSolderingmendationguidelines.•Designedforsinglesolderreflowoperations. ProfileFeature Pb-FreeAssembly AverageRamp-UpRate(TSmaxtoTp) 3°C/secondmax. PREHEAT: TemperatureMin.(TSmin)TemperatureMax.(TSmax)TimDePesrc(otrcsiepmstisoinntotsmax) Materials Temperature
1.TApIMplyEsoMldAerINpaTstAeItNoEDAB•OSVnE96:.5/Ag3.0/Cu0.5Roomtemperature testTbeoamrdp(e8r-a1t0urmeil(tThiIc)k) Alloywatersolubleornocleansolderpaste Time(tL) (seenote1) Peak/ClassificationTe•ms(Gpin1eg0lre)a(stUiudLreedapepp(rTooxvPye)dg)lass Timewithin5°CofActu•aPlCPbeoaarkdaTpepmroxp.e4rxa4xtu.0r6ein.(tp)
2.Placetestunitsontoboard6units/board
3.RRaammppu-pDownRateConvectionoven (seenote2) TimeInterval 2.5°C±0.5°/sec. 150°C200°CIancscpeepctatbsloeld(ie.er.joe6ixnh0tib~toi1tsd8ew0teertsmtieningceooifnfjsodoisnldt’esrsjouirnfatcise). Usethefollowingcriteria(ref.eptabilityofprintedboardassemblies,IPC-A-610): A)eptable(seeFig2ur1e71)°C
(1)Thesolde6r0c~on1n5ec0tiosnewcoetntindgsangle(soldertocdoomespnoontenextcaenedd2s96o0l0d°e.°rCtoPCBtermination)
(2)Solderbal2ls0t~ha4t0dosneoctovinoldatseminimum electricalclearancesandareattached (soldere6d)°tCoa/mseetcalosnudrfamcea.x.
4.TPrimeheeatw(TitSh)in25°CtoPeakTemperature
5.Timeaboveliquidus(TL)
6.Peaktemperature(TP) HowtoOrder
7.RampdownMF-PSMF010/24X-
2 Multifuse®Product D8.eCsleiganniantgorwatercleanprofileHighpressuredeionized Series water65PSImax. PSMF=0805SurfaceMount Component HToelmd01pC0eu-rr1ar1et0nutr(,e0I.ho1o0fldL-e1a.1d0/PAamdpsJ)unction (HDeigrihveedruVsoinltgag6e-zoOnpetCioonnvectionOven)Blank=StandardVoltage/24=24V Multifuse®freeXpansion™Design PackagingPackagedperEIA481-1-2=TapeandReel 150°Cto190°C90±30sec. B)eptable8(smeeiFniguutrees2)max. 220°
C 60-90sec. 250°C+0°/-5°TypicalPartM10a-2r0ksinecg.within 5°Cofpeak
(1)Solderconnectionwettingangleexceeding90°. (2)pletereflowofsolderpaste.
(3)Dewetting. RRooemptreemspeenrattsurteota3l°cCo±n0te.5n°tC./sLeacy.vepatrayb.le,determinecauseandcorrectpriorto (seenote2) PARTIDEnNeTxIFtIrCuAnT.ION: 72°Fto160°F(22°Cto71°C) Asrequired
4 BIWEEKLYDATECODE MF-PSMFN01O0TXE=S1: MF-PSMF010/24X=MF-PSMF10.20XW=at2er 1soluble solder pAassteiaon-lPyaabcovifei1c0:0K. MF-PSMF035X=32.Refer to ref. temperatuTreepl:ro+fi8le8.T6e-m2pe2ra5tu6r2e-a4t117 MF-PSMF050X=4MF-PSMF075Xle=ad5/pad junction with E“Km”taypile: uosup@leb. WILLAPPEARONTHEPACKAGINGLABEL:WEEK1AND2=AWEEK51AND52=
Z MF-PSMF31.10XUn=i6tsthatareboardmEouuntreodpfoer:environmental testingmustseeazone,asspecified. pTehaisTkeitselmt:o+pee3nrsa6utur8ree8thina5tth2ael0lrtee3fslot9w0 unitswillsee“worstcaEsemcaonild:iteiounsro”.cus@
4.RampdownratetobeTmheaesuAremdferormic2a45s:°Cto 150°
C. Tel:+1-951781-5500 5.fPrraomceestsrimDemscerrisp.tion8Edomesaniol:taapmplyetroicoupesn@ MF-PSMFSERIES,REV.O05/17 “freeXpansionDesign”isatrademarkofBourns,Inc.Specificationsaresubjecttochangewithoutnotice.Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.Usersshouldverifyactualdeviceperformanceintheirspecificapplications. MF-PSMFSeriesTapeandReelSpecifications TapeDimensions WP0P1P2A0B0B1max.D0FE1E2min.Tmax.T1max.K0Leadermin.Trailermin.ReelDimensionsAmax.Nmin.W1W2max.
T D0 COVERTAPE B1 P0P2 MF-PSMF010X,MF-PSMF010/24X,MF-PSMF020X,MF-PSMF035X& MF-PSMF050XperEIA481-1 8.0±0.30(0.315±0.012) 4.0±0.10(0.157±0.004) 4.0±0.10(0.157±0.004) 2.0±0.05(0.079±0.002) 1.65±0.10(0.065±0.004) 2.4±0.10(0.094±0.004) 4.35(0.171)1.50+0.10/-0.0(0.059+0.004/-0)3.5±0.05(0.138±0.002)1.75±0.10(0.069±0.004) 6.25(0.246) 0.6(0.024) 0.10(0.004)0.95±0.10(0.037±0.004) 390(15.35) 160(6.30) 185(7.28) 50(1.97)8.4+1.5/-0.0(0.331+0.059/-0)14.4(0.567) UNIT=MM(INCHES) E1 FA E2W MF-PSMF075X&MF-PSMF110XperEIA481-1 8.0±0.30(0.315±0.012) 4.0±0.10(0.157±0.004) 4.0±0.10(0.157±0.004) 2.0±0.05(0.079±0.002) 1.65±0.10(0.065±0.004) 2.4±0.10(0.094±0.004) 4.35(0.171)1.50+0.10/-0.0(0.059+0.004/-0)3.5±0.05(0.138±0.002)1.75±0.10(0.069±0.004) 6.25(0.246) 0.6(0.024) 0.10(0.004)1.25±0.10(0.049±0.004) 390(15.35) 160(6.30) 185(7.28) 50(1.97)8.4+1.5/-0.0(0.331+0.059/-0)14.4(0.567) W2(MEASUREDATHUB) N(HUBDIA.) B0 K0 P1 T1 A0 Specificationsaresubjecttochangewithoutnotice.Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.Usersshouldverifyactualdeviceperformanceintheirspecificapplications. W1(MEASUREDATHUB) MouserElectronics AuthorizedDistributor ClicktoViewPricing,Inventory,Delivery&LifecycleInformation: Bourns: MF-PSMF050X-2MF-PSMF075X-2MF-PSMF110X-2MF-PSMF020X-2MF-PSMF035X-2MF-PSMF010X-
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