NewHampshire–CorporateHeadquarters603-635-2800
TechnicalDiscussion…
Background:
WhatisaHeatSink?
Aheatsink(orheatsink)isanenvironmentorobjectthatabsorbsanddissipatesheatfromanotherobjectusingthermalcontact(eitherdirectorradiant).Heatsinksareusedinawiderangeofapplicationswhereverefficientheatdissipationisrequired;majorexamplesincluderefrigeration,heatengines,coolingelectronicdevicesandlasers. Principle: Heatsinksfunctionbyefficientlytransferringthermalenergy("heat")fromanobjectatarelativelyhightemperaturetoasecondobjectatalowertemperaturewithamuchgreaterheatcapacity.Thisrapidtransferofthermalenergyquicklybringsthefirstobjectintothermalequilibriumwiththesecond,loweringthetemperatureofthefirstobject,fulfillingtheheatsink'sroleasacoolingdevice.Efficientfunctionofaheatsinkreliesonrapidtransferofthermalenergyfromthefirstobjecttotheheatsink,andtheheatsinktothesecondobject. Themondesignofaheatsinkisametaldevicewithmanyfins.Thehighthermalconductivityofthebinedwithitslargesurfaceareaduetothefinsresultintherapidtransferofthermalenergytothesurrounding,cooler,air.Thiscoolstheheatsinkandwhateveritisindirectthermalcontactwith.Useoffluids(forexamplecoolantsinrefrigeration)andthermalinterfacematerial(incoolingelectronicdevices)ensuresgoodtransferofthermalenergytotheheatsink.Similarlyafanmayimprovethetransferofthermalenergyfromtheheatsinktotheairbymovingcoolerairbetweenthefins. VarietyofWakefieldExtrusionProfilesusedasHeatSinks1 Pelham,NewHampshire–CorporateHeadquarters Performance: 603-635-2800 Heatsinkperformance(includingfreeconvection,forcedconvection,liquidcooled,andbinationthereof)isafunctionofmaterial,geometry,andoverallsurfaceheattransfercoefficient.Generally,forcedconvectionheatsinkthermalperformanceisimprovedbyincreasingthethermalconductivityoftheheatsinkmaterials,increasingthesurfacearea(usuallybyaddingextendedsurfaces,suchasfinsorfoammetal)andbyincreasingtheoverallareaheattransfercoefficient(usuallybyincreasefluidvelocity,suchasaddingfans,pumps,etcetera). TheChartillustratestheHeatSinkThermalResistanceValues,(C/W)fortwodifferentWakefieldIGBTExtrusionProfilesasafunctionofAirFlow,(LinearFeetperMinute–LFM).Note:theessentiallyequalthermalperformanceofeachprofileasindependentoftheactualprofilegeometry–but,withessentiallyequalProfilePerimeters.
2 Pelham,NewHampshire–CorporateHeadquarters603-635-2800 Explanation: monuse,aheatsinkisametalobjectbroughtintocontactwithanponent'shotsurface—thoughinmostcases,athinthermalinterfacematerialmediatesbetweenthetwosurfaces.Microprocessorsandpowerhandlingsemiconductorsareexamplesofelectronicsthatneedaheatsinktoreducetheirtemperaturethroughincreasedthermalmassandheatdissipation(primarilybyconductionandconvectionandtoalesserextentbyradiation).Heatsinksarewidelyusedinelectronics,andhaveealmostessentialtomodernintegratedcircuitslikemicroprocessors,DSPs,GPUs,IGBTsandmore. CFDExampleofThermalHeatDissipation–IGBTHeatSink ExampleofThermalHeatDissipation–IGBTHeatSinkwithThreeHeatSources–ViewisoftheHeatSinkBase3 Pelham,NewHampshire–CorporateHeadquarters603-635-2800 ConstructionandMaterials: Aheatsinkusuallyconsistsofabasewithoneormoreflatsurfacesandanarrayborfin-likeprotrusionstoincreasetheheatsink'ssurfaceareacontactingtheair,andthusincreasingtheheatdissipationrate.Whileaheatsinkisastaticobject,afanoftenaidsaheatsinkbyprovidingincreasedairflowovertheheatsink—thusmaintainingalargertemperaturegradientbyreplacingthewarmedairmorequicklythanpassiveconvectionachievesalone—thisisknownasaforcedairsystem.Heatsinksaremadefromagoodthermalconductorsuchascopperoraluminumalloy.Copper(401W/(m·K)at300K)issignificantlyheavierandmoreexpensivethanaluminum(237W/(m·K)at300K)butisalsoroughlytwiceasefficientasathermalconductor.Aluminumhasthesignificantadvantagethatitcanbeeasilyformedbyextrusion,thusplexcross-sectionspossible.Theheatsink'scontactsurface(thebase)mustbeflatandsmoothtoensurethebestthermalcontactwiththeobjectneedingcooling.Frequently,athermallyconductivegreaseisusedtoensureoptimalthermalcontact;suchgreaseusuallycontainsceramicmaterialssuchasberylliumoxideandaluminumnitride,butmayalternativelycontainfinelydividedmetalparticles,e.g.zincoxideandcolloidalsilver.Further,aclampingmechanism,screws,orthermaladhesiveholdtheheatsinktightlyontoponenttomaximizethermalconductivity,butspecificallywithoutpressurethatwouldcrushponent. CustomWakefieldEpoxyBondedHeatSink–UtilizingCopperFinsbinationwithAluminumFinstooptimizetheheatconductionandavoidcostlyHeatPipes
4 Pelham,NewHampshire–CorporateHeadquarters603-635-2800 HeatSinkoptimizationthroughdesignanduseofmaterialoptionshasenabledWakefieldSolutionstoprovidecustomerswithcosteffectivethermal/mechanicalsolutionstotheirmostdemandingapplications. WAKEFIELDTHERMOVATIONScansupportcustomersduringtheanystageofnew productdevelopment–usingbinedknowledgeofover100yearsofdesigningandmanufacturingexperience–ourThermalandMechanicalEngineersaremosteffectivewhentheyareengagedearlyinthedevelopmentprocess.ContactInfo:WakefieldSolutionsInc.33BridgeSt.Pelham,NH03076603-635-2800info@
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Aheatsink(orheatsink)isanenvironmentorobjectthatabsorbsanddissipatesheatfromanotherobjectusingthermalcontact(eitherdirectorradiant).Heatsinksareusedinawiderangeofapplicationswhereverefficientheatdissipationisrequired;majorexamplesincluderefrigeration,heatengines,coolingelectronicdevicesandlasers. Principle: Heatsinksfunctionbyefficientlytransferringthermalenergy("heat")fromanobjectatarelativelyhightemperaturetoasecondobjectatalowertemperaturewithamuchgreaterheatcapacity.Thisrapidtransferofthermalenergyquicklybringsthefirstobjectintothermalequilibriumwiththesecond,loweringthetemperatureofthefirstobject,fulfillingtheheatsink'sroleasacoolingdevice.Efficientfunctionofaheatsinkreliesonrapidtransferofthermalenergyfromthefirstobjecttotheheatsink,andtheheatsinktothesecondobject. Themondesignofaheatsinkisametaldevicewithmanyfins.Thehighthermalconductivityofthebinedwithitslargesurfaceareaduetothefinsresultintherapidtransferofthermalenergytothesurrounding,cooler,air.Thiscoolstheheatsinkandwhateveritisindirectthermalcontactwith.Useoffluids(forexamplecoolantsinrefrigeration)andthermalinterfacematerial(incoolingelectronicdevices)ensuresgoodtransferofthermalenergytotheheatsink.Similarlyafanmayimprovethetransferofthermalenergyfromtheheatsinktotheairbymovingcoolerairbetweenthefins. VarietyofWakefieldExtrusionProfilesusedasHeatSinks1 Pelham,NewHampshire–CorporateHeadquarters Performance: 603-635-2800 Heatsinkperformance(includingfreeconvection,forcedconvection,liquidcooled,andbinationthereof)isafunctionofmaterial,geometry,andoverallsurfaceheattransfercoefficient.Generally,forcedconvectionheatsinkthermalperformanceisimprovedbyincreasingthethermalconductivityoftheheatsinkmaterials,increasingthesurfacearea(usuallybyaddingextendedsurfaces,suchasfinsorfoammetal)andbyincreasingtheoverallareaheattransfercoefficient(usuallybyincreasefluidvelocity,suchasaddingfans,pumps,etcetera). TheChartillustratestheHeatSinkThermalResistanceValues,(C/W)fortwodifferentWakefieldIGBTExtrusionProfilesasafunctionofAirFlow,(LinearFeetperMinute–LFM).Note:theessentiallyequalthermalperformanceofeachprofileasindependentoftheactualprofilegeometry–but,withessentiallyequalProfilePerimeters.
2 Pelham,NewHampshire–CorporateHeadquarters603-635-2800 Explanation: monuse,aheatsinkisametalobjectbroughtintocontactwithanponent'shotsurface—thoughinmostcases,athinthermalinterfacematerialmediatesbetweenthetwosurfaces.Microprocessorsandpowerhandlingsemiconductorsareexamplesofelectronicsthatneedaheatsinktoreducetheirtemperaturethroughincreasedthermalmassandheatdissipation(primarilybyconductionandconvectionandtoalesserextentbyradiation).Heatsinksarewidelyusedinelectronics,andhaveealmostessentialtomodernintegratedcircuitslikemicroprocessors,DSPs,GPUs,IGBTsandmore. CFDExampleofThermalHeatDissipation–IGBTHeatSink ExampleofThermalHeatDissipation–IGBTHeatSinkwithThreeHeatSources–ViewisoftheHeatSinkBase3 Pelham,NewHampshire–CorporateHeadquarters603-635-2800 ConstructionandMaterials: Aheatsinkusuallyconsistsofabasewithoneormoreflatsurfacesandanarrayborfin-likeprotrusionstoincreasetheheatsink'ssurfaceareacontactingtheair,andthusincreasingtheheatdissipationrate.Whileaheatsinkisastaticobject,afanoftenaidsaheatsinkbyprovidingincreasedairflowovertheheatsink—thusmaintainingalargertemperaturegradientbyreplacingthewarmedairmorequicklythanpassiveconvectionachievesalone—thisisknownasaforcedairsystem.Heatsinksaremadefromagoodthermalconductorsuchascopperoraluminumalloy.Copper(401W/(m·K)at300K)issignificantlyheavierandmoreexpensivethanaluminum(237W/(m·K)at300K)butisalsoroughlytwiceasefficientasathermalconductor.Aluminumhasthesignificantadvantagethatitcanbeeasilyformedbyextrusion,thusplexcross-sectionspossible.Theheatsink'scontactsurface(thebase)mustbeflatandsmoothtoensurethebestthermalcontactwiththeobjectneedingcooling.Frequently,athermallyconductivegreaseisusedtoensureoptimalthermalcontact;suchgreaseusuallycontainsceramicmaterialssuchasberylliumoxideandaluminumnitride,butmayalternativelycontainfinelydividedmetalparticles,e.g.zincoxideandcolloidalsilver.Further,aclampingmechanism,screws,orthermaladhesiveholdtheheatsinktightlyontoponenttomaximizethermalconductivity,butspecificallywithoutpressurethatwouldcrushponent. CustomWakefieldEpoxyBondedHeatSink–UtilizingCopperFinsbinationwithAluminumFinstooptimizetheheatconductionandavoidcostlyHeatPipes
4 Pelham,NewHampshire–CorporateHeadquarters603-635-2800 HeatSinkoptimizationthroughdesignanduseofmaterialoptionshasenabledWakefieldSolutionstoprovidecustomerswithcosteffectivethermal/mechanicalsolutionstotheirmostdemandingapplications. WAKEFIELDTHERMOVATIONScansupportcustomersduringtheanystageofnew productdevelopment–usingbinedknowledgeofover100yearsofdesigningandmanufacturingexperience–ourThermalandMechanicalEngineersaremosteffectivewhentheyareengagedearlyinthedevelopmentprocess.ContactInfo:WakefieldSolutionsInc.33BridgeSt.Pelham,NH03076603-635-2800info@
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